Product Details
The HAL5224 Hot Air Solder Leveling System is designed to provide the highest quality solder leveling at high throughput rates while preserving the highest reliability and serviceability standards available. Argus International has been designing, building and operating HASL systems for over a decade. The experience earned in a decade of dedication to engineering the HASL process is evident by the high quality work produced.
Key Benefits
The PC3800 Series flux application systems are designed to support the HAL5224 Hot Air Solder Leveling system by applying flux to circuit boards prior to the HASL process. The PC3800 employs three sets of nappy type rollers to provide complete flux coverage while minimizing flux usage. The first roller applies flux to the entire board surface. The second roller forces flux into the barrels and removes excess flux from the board surface. The third roller serves as a squeegee to remove all excess flux coverage. Excess flux is filtered and recycled providing a significant cost savings.
Key Benefits
The PC3400 Series flux application systems are designed to support the HAL5224 Hot Air Solder Leveling system by applying flux to circuit boards prior to the HASL process. The PC3400 employs a set of nappy type rollers to provide complete flux coverage. The first roller applies flux to the entire board surface. The second roller forces flux into the barrels providing complete surface coverage. Excess flux is filtered and recycled proving a significant cost savings.
Key Benefits
The Argus International HL509 is a deep solder pot that uses a unique heating technique (patents pending) to make the tin-copper compound more buoyant, and thereby float to the top. Once the tin-copper slush is concentrated at the top it is simply removed and sent for metal recovery. The remaining solder contains less than .2% copper, well under the typically specified level of .3%. The recycled solder may simply be cast into ingots for storage.
Key Benefits
The PC4700 and PC4800 Series fusing systems were designed to reflow double sided and low mass multilayer circuit boards. The system consists of one temperature-controlled long-wave IR emitting zone for a saturating preheat (this feature on PC4800 system only), and one short-wave IR emitting zone with independent upper/lower lamp control. This patented fusing technique provides a wider process window than all lamp systems. The preheat and reflow zone emitters are selected specifically for preheat and reflow purposes, respectively.
Key Benefits
The PC5500 Series precleaning systems were designed to precede Argus PC4800 and PC4700 fusing systems as well as the Argus Hot Air Solder Leveling systems. The machine is designed to provide a vigorous spray cleaning, fresh water rinse and turbo air dry.
Key Benefits
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