Product Details


Hot Air Leveler HAL5224

The HAL5224 Hot Air Solder Leveling System is designed to provide the highest quality solder leveling at high throughput rates while preserving the highest reliability and serviceability standards available. Argus International has been designing, building and operating HASL systems for over a decade. The experience earned in a decade of dedication to engineering the HASL process is evident by the high quality work produced.

Key Benefits

Stainless steel construction, integrated exhaust hood ducting, complete solder pot accessibility, high speed DC motor driven vertical arm, and fixed angle air knives are just a few of the features that are standard on the HAL5224.
 
Also available are a variety of 'quick-change' clamping mechanisms, remote control console and solder refinement systems. These features combine to produce 200 panels an hour average, 350 panels an hour maximum.
 
The clamp/knife arrangements most commonly used are the 'Pressure' and 'Pin' type. The 'Pressure' type clamp utilizes air pressure to apply a finger type force to the panel. The 'Pin' type clamp uses two tooling pins to 'hang' the board, and air pressure forces the board upward and locks it into place.

PC3800 Fluxer Series

The PC3800 Series flux application systems are designed to support the HAL5224 Hot Air Solder Leveling system by applying flux to circuit boards prior to the HASL process. The PC3800 employs three sets of nappy type rollers to provide complete flux coverage while minimizing flux usage. The first roller applies flux to the entire board surface. The second roller forces flux into the barrels and removes excess flux from the board surface. The third roller serves as a squeegee to remove all excess flux coverage. Excess flux is filtered and recycled providing a significant cost savings.

Key Benefits

The PC3800 has an optional mini-accumulator that enables the operator to make minor system adjustments without stopping production.
 
The PC3800 has an optional 24 inch entrance extension to ease board loading when precleaning is not in-line.

PC3400 Fluxer Series

The PC3400 Series flux application systems are designed to support the HAL5224 Hot Air Solder Leveling system by applying flux to circuit boards prior to the HASL process. The PC3400 employs a set of nappy type rollers to provide complete flux coverage. The first roller applies flux to the entire board surface. The second roller forces flux into the barrels providing complete surface coverage. Excess flux is filtered and recycled proving a significant cost savings.

Key Benefits

The PC3400 includes a preheat stage which allows the panel to enter the HASL system warm, this reduces the heat loading in the solder pot and can make some fluxes more active. Preheating of high-mass circuit boards enables increased HASL production by minimizing solder pot dwell times.

HL509 Solder Refiner

The Argus International HL509 is a deep solder pot that uses a unique heating technique (patents pending) to make the tin-copper compound more buoyant, and thereby float to the top. Once the tin-copper slush is concentrated at the top it is simply removed and sent for metal recovery. The remaining solder contains less than .2% copper, well under the typically specified level of .3%. The recycled solder may simply be cast into ingots for storage.

Key Benefits

Copper contamination presents a problem in soldering application. High concentrations cause formation of intermetallic tin-copper creating gritty, grainy, slushy solder. The Argus HL509 Solder Refiner reduces copper contamination in solder and makes it suitable for reuse in Hot Air Leveling and/or Wave Soldering applications. The HL509 Solder Refinement Systems provides a 90% recycling of solder in copper contaminated solder.

Fusers

The PC4700 and PC4800 Series fusing systems were designed to reflow double sided and low mass multilayer circuit boards. The system consists of one temperature-controlled long-wave IR emitting zone for a saturating preheat (this feature on PC4800 system only), and one short-wave IR emitting zone with independent upper/lower lamp control. This patented fusing technique provides a wider process window than all lamp systems. The preheat and reflow zone emitters are selected specifically for preheat and reflow purposes, respectively.

Key Benefits

The control system provides highly accurate temperature and lamp power control. Temperature control is within 2 degrees Celsius. Lamp power control is within 1% of full power. Conveyor speed is controlled to within 1% of full speed.

Pre-Cleaners PC5500 Series

The PC5500 Series precleaning systems were designed to precede Argus PC4800 and PC4700 fusing systems as well as the Argus Hot Air Solder Leveling systems. The machine is designed to provide a vigorous spray cleaning, fresh water rinse and turbo air dry.

Key Benefits

The importance of starting a process with a clean surface cannot be stressed enough. This system provides excellent board cleanliness prior to fusing and/or HASL processes. To maintain machine cleanliness all controls are mounted on a NEMA-rated control console that may be placed up to 10 feet from the machine.

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