The HAL5224 Hot Air Solder Leveling System is designed to provide the highest quality solder leveling at high throughput rates while preserving the highest reliability and serviceability standards available. Argus International has been designing, building and operating HASL systems for over a decade. The experience earned in a decade of dedication to engineering the HASL process is evident by the high quality work produced.

With the increasing use by the PCB Industry of lead free solders in mass production, Argus is pleased to inform our customers that our lead free compatible hot air leveler unit, Model HAL5224, is available. Also available for our existing hot air leveler customers are new retrofit kits for Model HAL5124 as well as for HAL5224. These retrofit kits are based on tests done on the existing Argus HAL5124 models at Instrumatic Inc, Cleveland, OH; Monitrol Center Inc., Elk Grove Village, IL and Malmo Monsterkort AB, Sweden.

The two widely used lead free solder alloys tested on the ARGUS retrofitted machines are:

Argus HAL equipment is built from Types 316, 304 and 17-4 stainless steel.  This material is stable for erosion of the above alloys.

Operating temperature range was from 255° C up to 280° C with the dwell time from 4 seconds up to 6.5 seconds.  This test shows acceptable results with full solder thickness control and solderability test, as well as consistent uniformity and flatness on the pads as was previously designed and confirmed on our units.  The test was done by using standard chemistry on currently used precleaners and fluxing applicators.

In order to decide which retrofit kit you need, it is necessary for you to contact the Argus service department to determine what equipment must be added to your existing unit; it can be as simple as new temperature control cards, extra heat capacity option, or even a new solder tank.

We are continually in contact with major solder alloy suppliers to assist you in obtaining the proper materials for lead free HAL application and to help you with the lead free HAL process.

For more information on Lead Free HAL process, contact the Argus service department.

You can also check out matrixusa.us for more information on materials and chemistry.

The PC5500 Series precleaning systems were designed to precede the Argus HAL5000 Series Hot Air Solder Leveling systems. The machine is designed to provide a vigorous spray cleaning, fresh water rinse and turbo air dry.

The importance of starting a process with a clean surface cannot be stressed enough. This system provides excellent board cleanliness prior to fusing and/or HASL processes. To maintain machine cleanliness all controls are mounted on a NEMA-rated control console that may be placed up to 10 feet from the machine.

The PC3800 Series flux application systems are designed to support the Argus HAL5224 Hot Air Solder Leveling system by applying flux to circuit boards prior to the HASL process. The PC3800 employs three sets of nappy type rollers to provide complete flux coverage while minimizing flux usage. The first roller applies flux to the entire board surface. The second roller forces flux into the barrels and removes excess flux from the board surface. The third roller serves as a squeegee to remove all excess flux coverage. Excess flux is filtered and recycled providing a significant cost savings.

Key Benefits:

The PC3800 has an optional mini-accumulator that enables the operator to make minor system adjustments without stopping production.

The PC3800 has an optional 24 inch entrance extension to ease board loading when precleaning is not in-line.

Argus PC3600 Preheater Triple Fluxer Series

The PC3600 Series flux application systems are designed to support the Argus HAL5224 Hot Air Solder Leveling system by applying flux to circuit boards prior to the HASL process. The PC3600 employs three sets of nappy type rollers to provide complete flux coverage while minimizing flux usage. The first roller applies flux to the entire board surface. The second roller forces flux into the barrels and removes excess flux from the board surface. The third roller serves as a squeegee to remove all excess flux coverage. Excess flux is filtered and recycled providing a significant cost savings.

Key Benefits:

The PC3600 has an optional mini-accumulator that enables the operator to make minor system adjustments without stopping production.

The PC3600 includes a preheat stage which allows the panel to enter the HASL system warm, this reduces the heat loading in the solder pot and can make some fluxes more active. Preheating of high-mass circuit boards enables increased HASL production by minimizing solder pot dwell times.

The PC3400 Series flux application systems are designed to support the Argus HAL5224 Hot Air Solder Leveling system by applying flux to circuit boards prior to the HASL process. The PC3400 employs one set of nappy type rollers to provide complete flux coverage. The top roller applies flux to the entire board surface. The bottom roller forces flux into the barrels providing complete surface coverage. Excess flux is filtered and recycled proving a significant cost savings.

Key Benefits:

The PC3400 includes a preheat stage which allows the panel to enter the HASL system warm, this reduces the heat loading in the solder pot and can make some fluxes more active. Preheating of high-mass circuit boards enables increased HASL production by minimizing solder pot dwell times.

Argus HL2400 Postcleaners Series

The HL2400 series post cleaning systems were designed to follow the Argus HAL5224 series Hot Air Leveling systems. The machine is designed to provide a flux removal with two stages of vigorous spray cleaning, mild brushing action followed by a fresh water rinse and turbo air drying. Board cleanliness is critical to quality PCB fabrication and the HA2400 series equipment is designed to deliver.

HL2400 post clean system provides cooling zone conveyor to allow enough time for the circuit board to cool before it enters a recirculated spray cleaning and a mild brushing action that removes the most of the surface flux residue left over from the fusing process. The second recirculation chamber provides a recirculation of cleaner spray and mild brushing action and a final clean water rinse. The drain off of the second chamber feed and bleeds into the first chamber to minimize water usage. The drying system may have a turbo air knife to remove any puddle water and an infrared drying section to complete the drying process. A variety of brushing and drying options are available to maximize the effectiveness of the post cleaning system.

Key Benefits: